When people talk about the SMT process, they are talking about a technology related to printed circuit boards. It is an assembly technique that relates to the placement of components on printed circuit boards. This technique is increasingly being used because it provides low costs due to increased productivity. With SMT technique, the components and elements are applied directly to the surface of the PCB. This is in contrast to the conventional technique where components are applied through hole through the PCB, known as Through Hole Technology (THT). This SMT technique provides much higher placement speeds compared to the THT technique.
SMT stands for Surface Mounting Technology. This technology was developed in the 1960s and its use increased greatly during the 1980s. Using this technology, the industry has been able to greatly increase the number of placements per hour of components on a circuit board. For example, speeds of 40,000 placements using SMT technology are very common today.
How does SMT work?
So in practice, SMT is used within the manufacturing of PCB electronics. The electronic components are placed and soldered using fully automated production lines. Roughly speaking, you can divide the whole process into three steps:
The benefits of SMT
Surface Mount technology has a number of advantages. Not only the volume of electronic components but also the geometric dimension can be many times smaller than with continuous components. Another advantage is the high signal transmission rate. If the PCB is assembled on all sides, an assembly density of 5-5-20 solder joints per square centimeter can be achieved. An additional advantage is a high-frequency effect, as there are no leads or they are very short. This reduces RF interference and reduces distribution parameters. The SMT technology is ideal for automatic production, thereby also improving yield and product efficiency. Other advantages of SMT technology are:
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